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发表于 2010-3-2 11:39:22
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3Dlabs
H* w2 g3 } w/ K8 ?) M8x8 Semiconductor
6 Z* i: I$ U H5 c n2 hAcapella(英国)
" b& I: \1 O/ C5 |ACC Microelectronics
; M; u' E! ^! ]' bActel
& V. v. R1 E5 wAdaptec
# ]- u6 b6 n& W- Q8 Y. I; v' cAdaptive Logic 5 G9 T! D( r! k% H( d
Advanced Hardware Architectures % ?/ S& M! F0 h! Z4 {3 C& ]
Advanced Linear Devices
2 y* ?: a! q, E; F( p) l/ |9 gAdvanced Micro Devices 8 c3 L9 m: f; K' |; v
Advanced RISC Machines 2 ^1 z" S( J# G, n4 `( t
Advanced Technology Marketing, Inc.
7 H) _+ h: O/ y* Y1 R% M/ ZAKM Semiconductor 2 j" f( @* ^, P- y* T8 p
Alliance Semiconductor Corp. 8 j; \! y% D! Y/ c
Alpha Semiconductor
, e& d- R; P! H a0 @' o$ ^( FAlphatec Group
7 T- i2 M9 H% }- s$ q/ CAltera Y. i0 {5 Q4 H9 z$ o+ t% c& \
AMCC 7 q8 }, k( g6 W# x0 O% j
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7 ~8 ^( E( Z8 J/ r1 I
AMS
# |% T; G$ B- Q; OAnadigics 6 j: R. K# |0 _1 W
Analog Devices, Inc.(美国模拟器件)
0 A2 T0 L, p- X1 JArray Microsystems
. ^4 U. p/ }; G. b) o$ m1 uAtmel Corporation / ]& u- Y! v: R
Auravision
4 D% H/ z5 F6 Y9 L; ?6 `# Y* XAureal Semiconductor , p# {5 F- ?8 P y
Avance Logic, Inc.
- o: ?8 e) c2 X& c/ ?, o4 dBenchmarq Microelectronics
: q( a1 [4 S4 |4 u7 A3 WBrooktree
1 U6 c% M. _8 h3 g4 U" OBurr-Brown
3 m! A5 w/ y, w; D: a1 T/ I; n9 r2 \Butterfly DSP, Inc. . l4 y* s% {6 D7 r, p; l
0 R0 O; @+ V" nC-Cube Microsystems 8 ?( g6 J; J* ~
Chartered Semiconductor
/ B/ w" y, w2 g( \6 P; B* k# ~Cherry Semiconductor 7 j! \" A# C, {
Chip Express * p. [9 C$ C2 U2 r% E" l4 E
Chips and Technologies
; D& R* O) D& L$ K$ o: \4 PChrontel $ }: x! Z" e$ p
Cirrus Logic
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Compensated Devices
* R C3 F3 ?7 n7 j: G6 y% `Cree Research
4 Q6 U, b* ?1 K0 B; [6 ]Crosslink Semiconductor
: b4 J% s7 ~) J3 T! |5 W% A7 R; w6 yCrystal Semiconductor 9 G- s4 l& t, `2 C7 V
Cypress Semiconductor
! x) o0 I0 z( B# YCyrix & o: i: K% P" S7 X& _
Dallas Semiconductor Corp. - Z1 r1 Q, Q `( c
Data Delay Devices
& N4 ^3 w* |- A6 YDigital Equipment Corp.
: x, }! g& Z. i/ ^: i; U( `& i HE-LAB Digital Engineering
1 d9 _3 Z( u, s3 L6 F4 K2 L+ ~Electronic Designs, Inc.
7 ~- p; d! c, F9 jElantec 8 Z) A3 D+ q e# g
Enhanced Memory Systems 7 U J+ v4 A' Q# j& f( @* c
(爱普生EPSON ) - _# Y3 a2 ^& R) L9 D$ u
' m3 U! x1 Z1 w$ ~2 }& e* WExar
( O2 @4 Z" P4 y1 AExel
. O7 d- z& f. Z; |$ t5 ^0 A6 TExponential Technology - ^! D; r, C5 k
Es*** Corporation
6 Q7 W0 b" i1 r8 |7 cFairchild Semiconductor / T: V5 \2 O! C; S
Flip Chip Technologies 6 S/ c+ ?5 d3 _ b g9 ]" E! p
9 v: k: f6 f* p* w# H1 K8 X$ V& PFujitsu(日本富士通) Microelectronics, Inc.
2 }% W7 W; ?9 T% [( p. wGalileo Technology 5 @$ y; q* B1 a/ |$ p
Gateway Electronics Corporation
6 {1 v2 q) f+ r' d+ W) sGEC Plessey
, L$ k# A( l* f2 U# g7 p1 ]1 ZGeneral Instrument(通用仪器)
6 k0 D4 [' T5 a. E9 FGenesis Microchip 8 m7 }# D1 v5 J6 y4 v( n1 a
Gennum # }* n3 _6 m' T' p
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. y+ y) ~1 q" y4 U3 A9 f' ?- sGran-Jansen
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